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工艺流程优化：光斑采集，功率复检，测距调焦，气帘氮气

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wyj 3 months ago
parent 5c5b332711
commit 496f3bd643
1 changed files with 127 additions and 170 deletions
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295
LaiPuLaser/LaiPuLaser/CommonFlowMgr.cpp
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@ -3475,50 +3475,13 @@ void CCommonFlowMgr::CreatAnnealPrepareCmd(CWorkCmdInvoker &CmdInvoker,CWafer *
pCmd->BindingPar(pWafer);//绑定当前生产的wafer
CmdInvoker.AddCmd(pCmd);
}
//打开气帘
if(m_bAirCurtain)
{
{
CWorkCmdExcuteAction *pCmd = new CWorkCmdExcuteAction();
pCmd->SetExcuteAction(_ExcuteAction_IO_Write);
pCmd->SetIntParVal(_IO_W_Anneal_AirCurtain);
pCmd->SetBoolParVal(bOPEN);
CmdInvoker.AddCmd(pCmd);
}
}
//设置后续动作的平台速度为空移速度
{
CWorkCmdSetAsixSpeed *pCmd = new CWorkCmdSetAsixSpeed();
pCmd->SetAsixSpeedType(_AsixSpeedType_EmptyMoveXY);
CmdInvoker.AddCmd(pCmd);
}
//测距仪测量焦距(m_bPJobFirstWafer决定当前wafer 是否需要调整焦距)
if(gDeviceStateMgr->QueryUsedFunc(_EUsedFunc_LaserDisMeter) && (pWafer->m_bNeedFoucsAdjust))
{
//发送eap 事件
{
CSecsEventInfo EventInfo;
EventInfo.m_EventType = _SecsEvent_Wafer_FoucsAdjust_Start;
EventInfo.m_Wafer = pWafer;
CWorkCmdExcuteAction *pCmd = new CWorkCmdExcuteAction();
pCmd->SetExcuteAction(_ExcuteAction_SendSecsEvent);
pCmd->SetSecsEventInfo(EventInfo);
CmdInvoker.AddCmd(pCmd);
}
//创建自动校准的指令流程(完成后不回到焦距位置)(如果使用安全坐标,回到安全坐标)
CreatAutoFindFocusInvokerCmd(CmdInvoker,false);
//发送eap 事件
{
CSecsEventInfo EventInfo;
EventInfo.m_EventType = _SecsEvent_Wafer_FoucsAdjust_End;
EventInfo.m_Wafer = pWafer;
CWorkCmdExcuteAction *pCmd = new CWorkCmdExcuteAction();
pCmd->SetExcuteAction(_ExcuteAction_SendSecsEvent);
pCmd->SetSecsEventInfo(EventInfo);
CmdInvoker.AddCmd(pCmd);
}
}
//关闭气缸衰减器(现在XY 在测距仪位置)
//关闭气缸衰减器
{
CWorkCmdExcuteAction *pCmd = new CWorkCmdExcuteAction();
pCmd->SetExcuteAction(_ExcuteAction_IO_AirDimmerCtrl);
@ -3629,54 +3592,6 @@ void CCommonFlowMgr::CreatSubRecipeAnnealPrepareCmd(CWorkCmdInvoker &CmdInvoker
pCmd->SetExcuteAction(_ExcuteAction_CheckWarningMsg);
CmdInvoker.AddCmd(pCmd);
}
//自动控制N2
{
RecipePar = Recipe.GetRecipePar(RECIPE_PAR_NAME_N2_STATE);
bool bN2Open = RecipePar.m_ParBoolVal;
if (!bN2Open)
{
//停止使用MFC检测
{
CWorkCmdExcuteAction *pCmd = new CWorkCmdExcuteAction();
pCmd->SetExcuteAction(_ExcuteAction_MFCUseSignal);
pCmd->SetIntParVal(0);
pCmd->SetBoolParVal(bCLOSE);
pCmd->CanNotCancel();
CmdInvoker.AddCmd(pCmd);
}
}
{
CWorkCmdExcuteAction *pCmd = new CWorkCmdExcuteAction();
pCmd->SetExcuteAction(_ExcuteAction_IO_Write);
pCmd->SetIntParVal(_IO_W_Anneal_N2);
pCmd->SetBoolParVal(bN2Open);
CmdInvoker.AddCmd(pCmd);
}
if (bN2Open)
{
if (gAnnealMonitoringMgr->IsUseN2Flowmeter())
{
double CurVal = 0.0;
RecipePar = Recipe.GetRecipePar(RECIPE_PAR_NAME_USE_CUR_N2VAL);
if (RecipePar.m_ParBoolVal)
{
CRecipeParameter RecipePar2 = Recipe.GetRecipePar(RECIPE_PAR_NAME_N2_VAL);
CurVal = RecipePar2.m_ParDoubleVal;
}
else
{
CurVal = gAnnealMonitoringMgr->GetCurMFCVal();
}
//设置N2流量
{
CWorkCmdExcuteAction *pCmd = new CWorkCmdExcuteAction();
pCmd->SetExcuteAction(_ExcuteAction_SetN2Val);
pCmd->SetDoubleParVal(CurVal);
CmdInvoker.AddCmd(pCmd);
}
}
}
}
//检查LDD 状态
if(gDeviceStateMgr->QueryUsedFunc(_EUsedFunc_LaserDeviceCtrl))
{
@ -3730,6 +3645,46 @@ void CCommonFlowMgr::CreatSubRecipeAnnealPrepareCmd(CWorkCmdInvoker &CmdInvoker
gLogMgr->WriteLogInfo(LogInfo);
}
{
if (bCreatRecipeEdiCheckCmd)//创建cmd 不一定会执行
{
//Edi 复检开始工作(检查是否需要复检)
{
//功率密度复检参数是否发生变化
CWorkCmdExcuteAction *pCmd = new CWorkCmdExcuteAction();
pCmd->SetExcuteAction(_ExcuteAction_EdiCheckStart);
pCmd->SetBoolParVal(bRcpEdiParChange);
pCmd->SetBoolParVal2(pWafer->m_bNeedEdiCheck);//是否需要复检
CmdInvoker.AddCmd(pCmd);
}
//抓取光斑数据(Laser1和Laser2合并抓取一次)
//需要复检的时候才抓取光斑参数
if (!m_bIsManusal_Anneal_Test
&&gAnnealMonitoringMgr->IsbBeamCheckOnJobStart()
&& gDeviceStateMgr->QueryUsedFunc(_EUsedFunc_LaserBeamMeter))
{
//发送eap 事件
{
CSecsEventInfo EventInfo;
EventInfo.m_EventType = _SecsEvent_Beam_Check_Start;
EventInfo.m_Wafer = pWafer;
CWorkCmdExcuteAction *pCmd = new CWorkCmdExcuteAction();
pCmd->SetExcuteAction(_ExcuteAction_SendSecsEvent);
pCmd->SetSecsEventInfo(EventInfo);
CmdInvoker.AddCmd(pCmd);
}
CreatLaserBeamFlowCmd(CmdInvoker, pWafer, true);
//发送eap 事件
{
CSecsEventInfo EventInfo;
EventInfo.m_EventType = _SecsEvent_Beam_Check_End;
EventInfo.m_Wafer = pWafer;
CWorkCmdExcuteAction *pCmd = new CWorkCmdExcuteAction();
pCmd->SetExcuteAction(_ExcuteAction_SendSecsEvent);
pCmd->SetSecsEventInfo(EventInfo);
CmdInvoker.AddCmd(pCmd);
}
}
}
//设置SubRecipe 的激光参数(频率电流和延时)
//Rcp 电流是0的时候也需要把电流设置为0
//参数不变的时候这个步骤不会消耗时间
@ -3887,89 +3842,6 @@ void CCommonFlowMgr::CreatSubRecipeAnnealPrepareCmd(CWorkCmdInvoker &CmdInvoker
//这个时候的激光参数已经设置为recipe 的参数
if(bCreatRecipeEdiCheckCmd)//创建cmd 不一定会执行
{
//Edi 复检开始工作(检查是否需要复检)
{
//功率密度复检参数是否发生变化
CWorkCmdExcuteAction *pCmd = new CWorkCmdExcuteAction();
pCmd->SetExcuteAction(_ExcuteAction_EdiCheckStart);
pCmd->SetBoolParVal(bRcpEdiParChange);
pCmd->SetBoolParVal2(pWafer->m_bNeedEdiCheck);//是否需要复检
CmdInvoker.AddCmd(pCmd);
}
//抓取光斑数据(Laser1和Laser2合并抓取一次)
//需要复检的时候才抓取光斑参数
if (!m_bIsManusal_Anneal_Test&&gAnnealMonitoringMgr->IsbBeamCheckOnJobStart() && gDeviceStateMgr->QueryUsedFunc(_EUsedFunc_LaserBeamMeter))
{
//发送eap 事件
{
CSecsEventInfo EventInfo;
EventInfo.m_EventType = _SecsEvent_Beam_Check_Start;
EventInfo.m_Wafer = pWafer;
CWorkCmdExcuteAction *pCmd = new CWorkCmdExcuteAction();
pCmd->SetExcuteAction(_ExcuteAction_SendSecsEvent);
pCmd->SetSecsEventInfo(EventInfo);
CmdInvoker.AddCmd(pCmd);
}
CreatLaserBeamFlowCmd(CmdInvoker, pWafer, true);
//发送eap 事件
{
CSecsEventInfo EventInfo;
EventInfo.m_EventType = _SecsEvent_Beam_Check_End;
EventInfo.m_Wafer = pWafer;
CWorkCmdExcuteAction *pCmd = new CWorkCmdExcuteAction();
pCmd->SetExcuteAction(_ExcuteAction_SendSecsEvent);
pCmd->SetSecsEventInfo(EventInfo);
CmdInvoker.AddCmd(pCmd);
}
}
#if 0
//这里角度调整 _ExcuteAction_EdiCheckStart 后自适应，后面脉宽复检前等待自适应结束提升效率
if (gDeviceStateMgr->QueryUsedFunc(_EUsedFunc_TekOscilloscope))
{
CExcuteActionPar ActionPar;
ActionPar.m_ExcuteAction = _ExcuteAction_AdjustOsiiMaxAmplitude;
ActionPar.m_DoubleParVal = lfPluseWidth;//工艺时需要赋值需要的脉宽用于判断自适应成功
if (!bLaser2EdiZero && !bLaser1EdiZero)
{
ActionPar.m_DoubleParVal2 = 0;//工艺时需要赋值需要的脉宽用于判断自适应成功
}
else if (!bLaser1EdiZero)
{
ActionPar.m_DoubleParVal2 = lfLaser1PluseWidthOffset;//工艺时需要赋值需要的脉宽用于判断自适应成功
}
else if (!bLaser2EdiZero)
{
ActionPar.m_DoubleParVal2 = lfLaser2PluseWidthOffset;//工艺时需要赋值需要的脉宽用于判断自适应成功
}
CWorkCmdExcuteAction *pCmd = new CWorkCmdExcuteAction();
pCmd->SetExcuteActionPar(ActionPar);
pCmd->SetbEdiCheckCmd(true);//标记为edi check cmd
CmdInvoker.AddCmd(pCmd);
}
//把双光路复检LD转45度的cmd放到_ExcuteAction_EdiCheckStart 之后
//如果要进行edi check 并且使用两路激光的情况，先把衰减器2 的角度转到45
if((!bLaser2EdiZero && !bLaser1EdiZero)&&bCreatRecipeEdiCheckCmd)
{
double RotatoDimmer2Ang = POW_ZERO_DIMMER_ANG_45;
//log
{
Log.Format("->RotatoDimmer2Ang = %lf",RotatoDimmer2Ang);
LogInfo.m_LogMsg = Log;
gLogMgr->WriteLogInfo(LogInfo);
}
{
CExcuteActionPar ActionPar;
ActionPar.m_ExcuteAction = _ExcuteAction_RotatoDimmer_ToAngle;
ActionPar.m_DoubleParVal = RotatoDimmer2Ang;
ActionPar.m_IntParVal = (int)_LaserDeviceType_MainLaser2;
CWorkCmdExcuteAction *pCmd = new CWorkCmdExcuteAction();
pCmd->SetExcuteActionPar(ActionPar);
pCmd->SetbEdiCheckCmd(true);//标记为edi check cmd 不复检的时候就不执行
CmdInvoker.AddCmd(pCmd);
}
}
#endif
//XY移动到功率计位置
{
CWorkCmdAsixXYMove *pCmd = new CWorkCmdAsixXYMove();
@ -4214,6 +4086,32 @@ void CCommonFlowMgr::CreatSubRecipeAnnealPrepareCmd(CWorkCmdInvoker &CmdInvoker
CmdInvoker.AddCmd(pCmd);
}
}
//测距仪测量焦距(m_bPJobFirstWafer决定当前wafer 是否需要调整焦距)
if (gDeviceStateMgr->QueryUsedFunc(_EUsedFunc_LaserDisMeter) && (pWafer->m_bNeedFoucsAdjust))
{
//发送eap 事件
{
CSecsEventInfo EventInfo;
EventInfo.m_EventType = _SecsEvent_Wafer_FoucsAdjust_Start;
EventInfo.m_Wafer = pWafer;
CWorkCmdExcuteAction *pCmd = new CWorkCmdExcuteAction();
pCmd->SetExcuteAction(_ExcuteAction_SendSecsEvent);
pCmd->SetSecsEventInfo(EventInfo);
CmdInvoker.AddCmd(pCmd);
}
//创建自动校准的指令流程(完成后不回到焦距位置)(如果使用安全坐标,回到安全坐标)
CreatAutoFindFocusInvokerCmd(CmdInvoker, false);
//发送eap 事件
{
CSecsEventInfo EventInfo;
EventInfo.m_EventType = _SecsEvent_Wafer_FoucsAdjust_End;
EventInfo.m_Wafer = pWafer;
CWorkCmdExcuteAction *pCmd = new CWorkCmdExcuteAction();
pCmd->SetExcuteAction(_ExcuteAction_SendSecsEvent);
pCmd->SetSecsEventInfo(EventInfo);
CmdInvoker.AddCmd(pCmd);
}
}
//Z 轴到激光焦点位置(加上sub recipe 的焦距调整值)
//cmd执行时再去获取当前的激光焦距坐标
{
@ -4224,6 +4122,65 @@ void CCommonFlowMgr::CreatSubRecipeAnnealPrepareCmd(CWorkCmdInvoker &CmdInvoker
pCmd->SetMoveFlg(false);//移动到坐标
pCmd->SetbMoveToLaserFoucsZ(true,FoucsZAdjustVal);
CmdInvoker.AddCmd(pCmd);
}
//打开气帘
if (m_bAirCurtain)
{
{
CWorkCmdExcuteAction *pCmd = new CWorkCmdExcuteAction();
pCmd->SetExcuteAction(_ExcuteAction_IO_Write);
pCmd->SetIntParVal(_IO_W_Anneal_AirCurtain);
pCmd->SetBoolParVal(bOPEN);
CmdInvoker.AddCmd(pCmd);
}
}
//自动控制N2
{
RecipePar = Recipe.GetRecipePar(RECIPE_PAR_NAME_N2_STATE);
bool bN2Open = RecipePar.m_ParBoolVal;
if (!bN2Open)
{
//停止使用MFC检测
{
CWorkCmdExcuteAction *pCmd = new CWorkCmdExcuteAction();
pCmd->SetExcuteAction(_ExcuteAction_MFCUseSignal);
pCmd->SetIntParVal(0);
pCmd->SetBoolParVal(bCLOSE);
pCmd->CanNotCancel();
CmdInvoker.AddCmd(pCmd);
}
}
{
CWorkCmdExcuteAction *pCmd = new CWorkCmdExcuteAction();
pCmd->SetExcuteAction(_ExcuteAction_IO_Write);
pCmd->SetIntParVal(_IO_W_Anneal_N2);
pCmd->SetBoolParVal(bN2Open);
CmdInvoker.AddCmd(pCmd);
}
if (bN2Open)
{
if (gAnnealMonitoringMgr->IsUseN2Flowmeter())
{
double CurVal = 0.0;
RecipePar = Recipe.GetRecipePar(RECIPE_PAR_NAME_USE_CUR_N2VAL);
if (RecipePar.m_ParBoolVal)
{
CRecipeParameter RecipePar2 = Recipe.GetRecipePar(RECIPE_PAR_NAME_N2_VAL);
CurVal = RecipePar2.m_ParDoubleVal;
}
else
{
CurVal = gAnnealMonitoringMgr->GetCurMFCVal();
}
//设置N2流量
{
CWorkCmdExcuteAction *pCmd = new CWorkCmdExcuteAction();
pCmd->SetExcuteAction(_ExcuteAction_SetN2Val);
pCmd->SetDoubleParVal(CurVal);
CmdInvoker.AddCmd(pCmd);
}
}
}
}
//加工前立即检测一次光路功率
if (!m_bSubRecipeEdiEqualZero)

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