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#ifndef LOGIC_LOCAL_DEF_H
#define LOGIC_LOCAL_DEF_H
#include "logic_compdef.h"
//部分继电器
enum VarID_Logic {
Reserve_LogicVar_ID = 50000,
Var_AllSystem_Vacumm_TimeLimit_ID, //全局真空
Var_AllSystem_Vacumm_BreakTimeLimit_ID,//全局破真空时间限制
Var_AllSystem_CellExistCheckTime_ID,
Var_AllSystem_CurChID_ID,
Var_AllSystem_CellSize_ID,
Var_AllSystem_LaserState_ID,
Var_AllSystem_LightState_ID,
Var_AllSystem_SafeDoorConfig_ID,
Var_AllSystem_FullScreen_ID,
Var_AllSystem_EnableSoftKeyboard_ID,
Var_AllSystem_StyleSheet_Type_ID, //颜色风格
Var_AllSystem_Language_Type_ID, //多语言0 中文 1英文
Var_CheckBox_EnableCheck, //使能首片检测
Var_MaxCycle_Count, //最大Cycle次数
Var_Process_WaferCheckType, //Wafer检查类型 0不使用 1首片 2每片
Var_Enable_FixLaserPathAngle, //使能固定光路路径角度
Var_XY_AngleOffset, //< X,Y轴夹角
Var_Enable_JigCheck, //使能Jig检测
Var_MWorkTable_Load_X_ID = 50100, //上料位置
Var_MWorkTable_Load_Y_ID,
Var_MWorkTable_Load_Z_ID,
Var_MWorkTable_Load_W_ID,
Var_MWorkTable_Unload_X_ID, //下料位置
Var_MWorkTable_Unload_Y_ID,
Var_MWorkTable_Unload_Z_ID,
Var_MWorkTable_Unload_W_ID,
Var_MWorkTable_Manual_LoadX_ID, //手动上料位
Var_MWorkTable_Manual_LoadY_ID,
Var_WorkTable_Offset_Threshold,
Var_WorkTable_Offset_EnableOffset, //使能平台偏移
Var_MWorkTable_Unload_W_OFFSET_ID, //下料旋转偏移,为了晶圆反向W轴需要的偏移
Var_MWorkTable_FoucsPos_ID, //相机调焦参数
Var_MWorkTable_CaliSpd_ID, //调焦速度
Var_MWorkTable_CaliSpdMin_ID, //调焦速度低
Var_MWorkTable_CaliRange_ID, //调焦范围
Var_MWorkTable_CaliRangeMin_ID, //调焦范围小
Var_Cass_Slot_Count = 50200, //槽数
Var_Cass_Slot_Step, //槽间距
Var_ClawPos_CheckBox_ID, //手动单片料盒夹抓位,检测料盒抓取位
Var_Cass_FirstClawPos_ID, //首片夹爪位
Var_Cass_FirstScanPos_ID, //首片扫描位
Var_Cass_UnloadOffset_ID, //下料偏移
Var_Cass_CassUpPos_ID, //料盒上升位置
Var_Rail_Scan_Pos_ID, //扫描时轨道打开位置
Var_Cass_ScanPosStart, //扫描起点
Var_Cass_ScanPosEnd, //扫描终点
Var_Cass_ScanSensorOffset, //两个传感器的偏差2-1
Var_Cass_WaferThickness, //片厚
Var_Process_ScanSpeed, //扫片速度
Var_Process_WPOverrlapped_ThickLimit1, //叠片判定最小阈值,通过厚度进行判定
Var_Process_WPOverrlapped_ThickLimit2, //叠片判定最小阈值,通过厚度进行判定
Var_Process_WPMalposed_ThickLimit, //错位判定最小阈值,两个传感器的差值
Var_Process_UserTwoSensor, //是否使用两个传感器扫描
Var_Process_DelayCompensation, //延迟补偿
Var_Process_WaferExistsRange, //判定范围
Var_Process_Claw_PosWait = 50300, //夹爪等待位
Var_Process_Claw_PosCassOutReady, //抓出前的准备位置
Var_Process_Claw_PosCassOut, //夹爪料盒抓取位
Var_Process_Claw_PosCheckBoxOut, //夹爪检测料盒抓取位
Var_Process_Claw_PosWaferExistCheck, //出料口检查上面是否有晶圆
Var_Process_Claw_PosPutRail, //清洗台下料时的位置,使用统一的位置即可,不需要
Var_Process_Claw_PosPushReadyUnload, //清洗台下料时的位置推之前的位置可以与Var_Process_Claw_PosLocationPushPrepare位置一致
Var_Process_Claw_PosScanBarcode, //扫码枪读取位置
Var_Process_Claw_PosLocationReady, //拉到规整准备位置,晶圆拉到的位置
Var_Process_Claw_PosLocationPushPrepare, //规整推之前的位置,这里轴升降不与晶圆干涉
Var_Process_Claw_PosLocation, //夹抓规整位置
Var_Process_Claw_Offset_DisCassUnLoad, //料盒下料偏移
Var_Process_Claw_Offset_DisCheckBoxUnLoad, //检测料盒下料偏移 unused
Var_Process_Claw_Offset_DisClawLocation, //规整时夹抓向后偏移 unused
Var_Process_Claw_PosHCoat, //中转水平涂覆位
Var_Process_Claw_PosHClean, //中转水平清洗位
Var_Process_Claw_PosRailNear, //夹爪近轨道放置位
Var_Process_Claw_PosRailFar, //夹抓远轨道放置位
Var_Process_Trans_CylinderMove_TimeOut = 50400,
Var_Process_Trans_StepSleepTime,
Var_Process_Trans_PosVWait, //中转垂直等待位,也是安全位置
Var_Process_Trans_PosPickupWafer, //中转轴夹抓,取晶圆的位置 中转垂直抓取位
Var_Process_Trans_PosPutdownWafer,
Var_Process_Trans_PosRailNearReady, //中转垂直近轨道准备位置
Var_Process_Trans_PosRailNear, //中转垂直近轨道取放料位置
Var_Process_Trans_PosRailFarReady, //中转垂直远轨道准备位置
Var_Process_Trans_PosRailFar, //中转垂直远轨道取放料位置
Var_Process_Trans_PosTransVCoat, //中转垂直涂覆位置
Var_Process_Trans_PosTransVClean, //中转垂直清洗位置
Var_Process_Trans_PosTransHLock, //夹抓从规整台抓取晶圆的位置
Var_Process_Trans_GrapVOffset, //中转垂直抓取取料时向上偏移值,中能为正 UNUSED
Var_Process_Trans_PosVCoatFinish, //转移轴,从涂覆台提起准备位置
Var_Process_Trans_PosVCoatFinishLow, //第一阶段慢速取晶圆位置
Var_Process_Trans_PosVCleanFinish, //
Var_Process_RailNear_PosOpen = 50500, //规整开位置
Var_Process_RailNear_PosClose, //规整关位置
Var_Process_RailNear_PosOpenMax, //规整开最大位置
Var_Process_RailFar_PosOpen, //远轨道开位置
Var_Process_RailFar_PosClose, //远轨道关位置
Var_Process_RailFar_PosOpenMax, //远轨道开最大位置
Var_Process_Trans_PosRailCloseReady, //轨道闭合的位置较闭合位置稍大一点较ClosePull更小一点
Var_Process_Trans_PosRailClosePull, //拉晶圆的打得不够开的位置,远离料盒位置
Var_Process_Trans_PosRailOpenPull, //拉晶圆时打得更开的位置,靠近料盒位置打开得多一点,
// //OpenMax<Open<OpenPull<ClosePull<CloseReady<Close
Var_Process_Load_PosVWait = 50600, //上料中转垂直等待位,也是安全位置
Var_Process_Load_PosVRail, //上料中转轴夹抓,抓放的位置 中转垂直抓取位
Var_Process_Load_PosVWT, //平台放料位置
Var_Process_Load_PosHCoat, //中转垂直涂覆位置
Var_Process_Load_PosHWT, //上料水平平台位置
Var_Process_Load_PosHWait, //上料水平等待位置
Var_Process_Load_PosVCoatFinish, //上料轴,从涂覆台提起准备位置
Var_Process_Load_PosVCoatFinishLow, //上料轴,第一阶段慢速取晶圆位置
Var_Process_Unload_PosVWait = 50700, //下料中转垂直等待位,也是安全位置
Var_Process_Unload_PosVRail, //下料中转轴夹抓,抓放的位置 中转垂直抓取位
Var_Process_Unload_PosVWT, //平台垂直取料位
Var_Process_Unload_PosHClean, //中转垂直涂覆位置
Var_Process_Unload_PosHWT, //下料水平平台位置
Var_Process_Unload_PosHWait, //下料水平等待位置
Var_CoatClean_Spindle_Move_TimeOut = 50800, //主轴运动超时时间
Var_Coat_Nozzel_ShutSleep_ID, //关闭阀门后延时
Var_CoatClean_Single_Wait_Time,
Var_Coat_Clean_Arm_WaitPos_ID, //清洗手臂准备位置
Var_Coat_Clean_Arm_EagePos_ID, //清洗手臂边缘位置
Var_Coat_Clean_Arm_CenterPos_ID,//清洗手臂中心位置
Var_Coat_Clean_Arm_RingPos_ID, //清洗铁环位置
Var_Coat_Clean_Arm_PerparePos_ID,//清洗准备位置
Var_Coat_Arm_WaitPos_ID, //手臂等待位置
Var_Coat_Arm_EagePos_ID, //手臂清洗的边缘
Var_Coat_Arm_CenterPos_ID, //手臂中心位置
Var_Coat_Arm_PerparePos_ID, //涂敷准备位置
Var_Coat_Spay_Num_ID, //涂敷胶量
Var_Coat_Spay_Pre_Num_ID, //预喷胶量
Var_Coat_Spay_Spd_ID, //涂敷喷胶速度
Var_Coat_Spay_ZeroOffset_ID, //涂敷喷胶原点
Var_Coat_Arm_Speed_ID, //清洗摆臂速度
Var_Coat_Spindle_InitPos_ID, //主轴初始角度位置
Var_Coat_Bubble_Thres_ID, //气泡报警阈值
Var_Coat_M_CenterSpeed_ID, //CoatM中心速度
Var_Coat_M_EageSpeed_ID, //CoatM边界速度
Var_Coat_M_CenterWaitTime_ID, //CoatM中心等待时间
Var_Coat_Protect_OpenPos_ID, //防水帘E4打开位置
Var_Coat_Protect_ClosePos_ID, //防水帘E4
Var_Process_Coat_TotalVolume, //总涂胶量
Var_Coat_Bump_Max_ID, //最大吸胶量
Var_Coat_Spay_Pre_WaitTime, //预喷胶等待时间
Var_Coat_ReplaceFluidVolume, //更换涂覆液需要排空量
Var_Coat_Clean_ProtectionBlockPos, //清洁保护块的位置
Var_CoatVolume_TareValue, //皮重
Var_CoatVolume_GlueDensity, //密度
Var_CoatVolume_AlarmVolume, //报警阈值
Var_CoatVolume_WarningVolume, //提醒阈值
Var_CoatVolume_ReplaceDate, //更换日期
Var_CoatVolume_InvalidDays, //失效天数
Var_CoatVolume_AlarmDiffVolume, //涂覆报警阈值
Var_Clean_Arm_Spd = 51000, //摆臂速度
Var_Clean_Arm_WaitPos_ID, //手臂等待位置
Var_Clean_Arm_Edge_Pos, //手臂清洗的边缘
Var_Clean_Arm_Center_Pos, //手臂清洗地的中心位置
Var_Clean_Arm_PerparePos_ID,
Var_Clean_Spindle_InitPos_ID, //主轴初始位置
Var_Clean_Protect_OpenPos_ID, //F2//防水帘打开位置
Var_Clean_Protect_ClosePos_ID, //F2//防水帘关闭位置
Var_Process_Trans_CleanGetWaferWaitTimeMs, //清洗台下料时等待多少ms
Var_KerfCheck_H_Rangemax = 51100,
Var_KerfCheck_H_Rangemin,
Var_KerfCheck_H_Threshold, //找线的灰度阈值
Var_KerfCheck_H_Direct_x,
Var_KerfCheck_H_Mount,
Var_KerfCheck_H_Minlength, //找到切割道的最小宽度
Var_KerfCheck_H_Maxlength, //找到切割道的最大宽度
Var_Process_Kerf_BeforeSearchSleep_ID = 51200,
Var_Process_Kerf_AfterSearchSleep_ID,
Var_Process_Kerf_PosOffset_ID,
Var_Process_Kerf_EnableAutoThres_ID,
Var_Process_Kerf_AutoThresRange_ID,
Var_Process_Kerf_AutoThresStep_ID,
Var_Process_Kerf_MinOffsetThres_ID, //!< 最小偏移阈值
Var_Process_Kerf_MaxOffsetThres_ID, //!< 最大偏移阈值
Var_Process_Kerf_EnableAutoCompensation, //!< 启用自动补偿
Var_Process_LaserFoucsCali_LineLength_ID = 51300,
Var_Process_LaserFoucsCali_StepZ_ID,
Var_Process_LaserFoucsCali_Count_ID,
Var_Process_LaserFoucsCali_GapDis_ID,
Var_Process_LaserFoucsCali_LaserFreq_ID,
Var_Process_LaserFoucsCali_LaserPower_ID,
Var_Process_LaserFoucsCali_SpeedX_ID,
Var_Process_LaserFoucsCali_AccRate_ID,
Var_Process_LaserFoucsCali_JerkRate_ID,
Var_Process_LaserFoucsCali_LaserEpulse_ID, //划线时的Epulse
//Var_Process_LaserFoucsCali_LaserBeamWidth_ID, //划线时的线宽
Var_Process_LaserPowerCali_XPos = 51400,
Var_Process_LaserPowerCali_YPos,
Var_Process_LaserPowerCali_ZPos,
Var_Process_LaserPowerCali_Step, //功率测量步长(次数)
Var_Process_LaserPowerCali_MeasTime, //测量前等待时间
Var_Process_LaserPowerCali_StableTime, //等待稳定时间
Var_Process_LaserPowerCali_StableThres, //稳定阈值
Var_Process_LaserPowerCali_PowerCheck_Thres, //功率复检偏差
Var_Process_PowerChekDate, //功率复检的时间
Var_Process_PowerCheckType, //功率检测类型 0不使用 1 首片 2每片 3按频率 4按时间间隔
Var_Process_PowerCheckTimeInterval, //功率检测时间间隔
Var_Process_PowerCheckFreq, //功率复检频率
Var_Process_LaserPowerCali_PowerCheck_ThresPercent, //功率复检偏差百分比
Var_Process_LaserPowerCali_G2Start,
Var_Process_LaserPowerCali_G2End,
Var_Process_Level_MaxLevelCount = 51500,
Var_Process_Level_MaxSearchCount,
Var_Process_Level_OffsetThres, //点2调平阈值
Var_Process_Level_AngleThres, //调平角度阈值
Var_Process_Level_ROIParent,
Var_Process_Level_LevelParent, //调平缩进比例
Var_Process_Level_MidStepOffset, //中点偏移比例
Var_Process_Level_BaseOffsetMax,
Var_Process_Level_BaseOffsetMin,
Var_Process_Level_ModelTestCount, //模板测试次数
Var_Process_Level_BeforeSearchSleep, //搜索前延时
Var_Process_Level_AfterSearchSleep,
Var_Process_Level_EnableAutoFoucs,
Var_Process_Level_MidOffsetThres, //中点偏移阈值,初步调平时的阈值
Var_Process_Level_AngleOffset, //旋转调平补偿值 不需要默认应该为0
Var_Process_Align_AFirst,
Var_Process_Align_AStep,
Var_Process_Align_BFirst,
Var_Process_Align_BStep,
Var_ProductSide_TemplateOffsetSideALowX,
Var_ProductSide_TemplateOffsetSideALowY,
Var_ProductSide_TemplateOffsetSideBLowX,
Var_ProductSide_TemplateOffsetSideBLowY,
Var_Process_ProductSide_CutStartA,
Var_Process_ProductSide_CutEndA,
Var_Process_ProductSide_CutStartB,
Var_Process_ProductSide_CutEndB,
Var_Process_LevelParamDouble_Reserved5,
Var_Process_LevelParamDouble_Reserved6,
Var_Process_LevelParamDouble_Reserved7,
Var_Process_LevelParamDouble_Reserved8,
Var_Process_LevelParamDouble_Reserved9,
Var_Process_LevelParamDouble_Reserved10,
Var_Process_ModelEnableLowOffset,
Var_Process_Enable_Align_Check,
Var_Process_EnableHalfcut_Check,
Var_Process_LevelParamInt_Reserved8,
Var_Process_LevelParamInt_Reserved9,
Var_Process_LevelParamInt_Reserved10,
Var_Process_Locate_LocateNum = 51600,
Var_Process_Locate_MaxDiameterError,
Var_Process_Locate_TowardOut,
Var_Process_Locate_SearchStep,
Var_Process_Locate_SearchCount, //!< 每个位置定位搜索次数
Var_Process_Locate_StopSleep, //!< 稳定延时
Var_Process_Locate_LightDirect, //!< 定位直光
Var_Process_Locate_LightSide, //!< 定位斜光
Var_Location_Exposure, //!< 定位使用的亮度
Var_Location_Gain, //!< 定位使用的增益
Var_Process_Locate_CenterX, //!< 定位时的基准中心X
Var_Process_Locate_CenterY, //!< 定位时的基准中心Y
Var_Process_Locate_TurnAngle, //!< 背光定位时W的基础角度
Var_LaserPath_PChangeAngle_ID = 51700, //!< P1 角度
Var_LaserPath_PowerMaxAngle_ID, //!< 最大功率角度
Var_LaserPath_DIndexZeroAngle_ID, //!< DIndex0点角度
Var_LaserPath_DIndexMax_ID, //!< DIndex最大值
Var_LaserPath_5050ZeroAngle_ID, //!< 5050初始角度
Var_LaserPath_5050CalcuStep_ID, //!< 5050角度步距
Var_LaserPath_SIndexZeroAngle_ID, //!< 挡板初始角度
Var_LaserPath_SIndexMax_ID, //!< 挡板最大角度
Var_LaserPath_HairOffsetThres_ID, //!< 光路偏移补偿最大值
Var_LaserPath_Use5050Vector_ID, //!< 是否使用点检数据计算功率
Var_LaserPath_PowerHomeOffsetAngle, //!< 衰减器回原点后偏移
Var_LaserPath_Homed, //!< 衰减器是否已经回原
Var_LaserPath_InitAngle, //初始角度,接近使用功率的角度
Var_LaserPath_AdjsutRate, //功率补偿系数默认为1,功率点检后恢复为1
Var_Process_LaserOffset, //激光偏移
Var_LaserPath_UseFixSetting, //! 使用固定的设定值
Var_LaserPath_Angle1, //! 设定固定值1
Var_LaserPath_Angle2, //! 设定固定值2
Var_LaserPath_UseFixPowerSetting,
Var_LaserPath_PowerSet,
Var_LaserPower_MeasRate, //功率测量系数默认为1
Var_Process_PowerCali_Type,
Var_LaserPower_Temperature, //功率器温度
Var_LaserUseTimeWarning, //换点操作提醒值
Var_LaserUseTimeErr, //换点操作报警值
Var_Process_LaserChekDate, //激光偏移复检的时间
Var_Process_LaserCheckType, //激光偏移检测类型 0不使用 1 首片 2每片 3按频率 4按时间间隔
Var_Process_LaserCheckTimeInterval, //激光偏移检测时间间隔
Var_Process_LaserCheckFreq, //激光偏移复检频率
Var_Process_LaserLightBeam_XPos,
Var_Process_LaserLightBeam_YPos,
Var_Process_LaserLightBeam_ZPos,
Var_Gripper_Power, //! 卡抓力度
Var_Gripper_Home_Direct,
Var_Gripper_Home_State,
//固定频率和Epulse
Var_LaserPath_UseFixFreq,
Var_LaserPath_FixFreqValue,
Var_LaserPath_UseFixEpulse,
Var_LaserPath_FixEpulseValue,
Var_LaserPath_UseFixGripper, //使用固定卡抓位置
Var_LaserPath_FixGripperPos,
Var_GateStartDelay, //划线前延时us
Var_GateEndDelay, //划线后延时us
Var_LensFLow_VolumeCheck_WaitTime,//!< 光路流量检测等待时间
Var_LensFlow_Volume_MinThres, //!< 光路流量最小值
Var_LensFlow_Volume_MaxThres, //!< 光路流量最大值
Var_MProduct_FlatPos_ID = 51800, //平边位置Top,Right,Bottom,Left
Var_MProduct_FlatLength_ID, //平边长度
Var_MProduct_CutType_ID, //加工类型 0 Line_Cycle,Side_Cycle 0往复一道切割
Var_MProduct_SizeType_ID,
Var_MProduct_MeasureDiameter, //测量尺寸
Var_MProduct_FirstCutb_ID,
Var_MProduct_FilmThick_ID, //!膜厚
Var_MProduct_EnableAlignment_ID,
Var_MProduct_ID, //产品识别码QString
Var_ProductSide_SideStep = 51900, //步进距离
Var_ProductSide_CutStreet, //切割道宽度
Var_ProductSide_StepDotLine, //点划线步进
Var_ProductSide_SolidDotLine, //实线长度
Var_ProductSide_InitAngle, //初始角度
Var_ProductSide_TemplateOffsetX, //模板偏移X
Var_ProductSide_TemplateOffsetY, //模板偏移Y
Var_Process_LaserKerf_AreaCenterX = 52000, //中心位置,激光样准块
Var_Process_LaserKerf_AreaCenterY,
Var_Process_LaserKerf_AreaValidWidth, //有效区域的宽度
Var_Process_LaserKerf_AreaType, //0 圆形 1矩形
Var_Process_LaserKerf_OuterErosionDistance, //外部区域缩减
Var_Process_LaserKerf_InnerErosionDistance, //内部区域缩减
Var_Process_LaserKerf_AreaCellDiameter, //每个小区域的尺寸
Var_Process_LaserKerf_ZFocusThickness, //焦点位置
Var_Process_LaserKerf_WorkTableYOffset, //平台误差补偿
Var_Process_LaserKerf_LineLength, //划线长度
Var_Process_LaserKerf_LineStep,
Var_Process_LaserKerf_CheckPower, //功率
Var_Process_LaserKerf_CheckFreq, //频率
Var_Process_LaserKerf_Speed,
Var_Process_LaserKerf_FocusLightDirect, //直光对焦时的参数
Var_Process_LaserKerf_FocusLightCircle, //斜光
Var_Process_LaserKerf_FocusExposure,
Var_Process_LaserKerf_FocusGain,
Var_Process_LaserKerf_CheckEpulse, //Epulse频率
Var_Process_LaserKerf_CheckBeamWidth, //线宽
Var_Process_KerfParm_LightDirect = 52100, //直光
Var_Process_KerfParm_LightCircle, //斜光
Var_Process_KerfParm_Exposure, //检测时的参数
Var_Process_KerfParm_Gain,
Var_Process_KerfParm_MinRange, //最小范围
Var_Process_KerfParm_MaxRange,
Var_Process_KerfParm_MinWidth, //最小线宽
Var_Process_KerfParm_MaxWidth,
Var_Process_KerfParm_MinOffset, //最大线宽
Var_Process_KerfParm_MaxOffset,
Var_Process_KerfParm_PixelThreshold, //最大线宽
Var_Process_KerfParm_BinThresold,
Var_Calibration_POSX = 52200, //定位的位置X坐标以X6相机为基准
Var_Calibration_POSY,
Var_Calibration_OffsetX, //模型识别到的位置偏移 X Y
Var_Calibration_OffsetY,
Var_Calibration_Angle, //模型识别到的角度
Var_Calibration_Adjust_Threshold, //调整阈值
Var_Calibration_POSZ,
Var_Distance_Measure_Thickness,
Var_MES_ClientIP = 52400, //IP和端口
Var_MES_ClientPort,
Var_MES_DeviceID,
Var_MES_MDLN, //设备名称
Var_MES_EnableComm,
Var_MES_ControlMode,
Var_MES_SoftVersion,
Var_MES_IsPassive, //是否被动模式
Var_MES_EnableLog,
Var_MES_AllowHostDownload,
Var_MES_RecipeRoot,
Var_MES_Timeout1,
Var_MES_Timeout2,
Var_MES_Timeout3,
Var_MES_Timeout4,
Var_MES_Timeout5,
Var_MES_Timeout6,
Var_MES_Timeout7,
Var_Gem_LinkTest_TimeOut_ID,
Var_MES_URL = 55000,
Var_MES_Host,
Var_MES_Path,
};
enum VarMsg_Logic {
VarMsg_Logic_Reserve = 60000,
//////////////////////定位
VarMsg_Locate_Process_ID,
VarMsg_Locate_Process_Before_ID,
VarMsg_Locate_Single_ID,
VarMsg_Locate_Search_Single_ID,
VarMsg_Locate_Process_After_ID,
//////////////////////调平
VarMsg_Align_Process_ID,
VarMsg_Align_Process_Before_ID,
VarMsg_Align_Search_ID,
VarMsg_Align_SearchFail_ID,
VarMsg_Align_AlignFail_ID,
/// 单点旋转调平
VarMsg_Align_Rotate_ID,
VarMsg_Align_R_MoveSearch_ID,
/// 单点旋转调平结束
/// 左点和中点调平
VarMsg_Main_Align_Near_ID,
VarMsg_Align_Pt1_MoveSearch_ID,
VarMsg_Align_PtMid_MoveSearch_ID,
/// 左点和中点调平结束
/// 左点和右点调平
VarMsg_Align_Far_ID,
VarMsg_Align_Pt2_MoveSearch_ID,
/// 左点和右点调平结束
/// 基准点设定
VarMsg_Align_Base_ID,
VarMsg_Align_PtBase_MoveSearch_ID,
VarMsg_Align_Process_After_ID,
//调平检查
VarMsg_Align_Check_ID,
///
//////////////////////调平结束/////////////
/////////加工
VarMsg_Cut_Process_Before_ID,
VarMsg_Cut_Process_ID,
VarMsg_Cut_Process_After_ID,
VarMsg_Cut_Layer_ID,
VarMsg_Kerf_Process_ID,
VarMsg_Cut_Finish_ID,
///////加工结束
//功率矫正
VarMsg_PowerCali_PowerRange_ID,
VarMsg_PowerCali_PowerPChange_ID,
VarMsg_PowerCali_PowerMax_ID,
//功率矫正结束
//上下料
VarMsg_Transfer_CheckState, //检查状态
VarMsg_Transfer_Step, //单步操作
VarMsg_Transfer_ResetPos,
VarMsg_Transfer_UnLoadAll,
VarMsg_Transfer_StateCheck,
VarMsg_Transfer_StartCoat,
VarMsg_Transfer_StartClean,
VarMsg_Transfer_StartCut,
VarMsg_Transfer_Finish,
VarMsg_Transfer_Sequence,
VarMsg_Transfer_Component,
VarMsg_Abort_Finish,
VarMsg_Auto_StartCoat, //自动涂敷过程
VarMsg_Auto_StartClean, //自动清洗过程
VarMsg_Auto_StartCut,
VarMsg_Manual_StartCut, //手动切割
VarMsg_Recover_StartCutCH1,
VarMsg_Recover_StartCutCH2,
//上下料结束
//清洗涂敷
VarMsg_CoatClean_BeforeAll,
VarMsg_CoatClean_Step,
VarMsg_CoatClean_AfterAll,
VarMsg_CoatClean_Wait,
VarMsg_CoatClean_Finished,
VarMsg_Coat_BumpTest, //吸胶
VarMsg_Coat_SpayTest, //喷胶
//清洗涂敷结束
//系统消息
VarMsg_System_ChangeCh,
VarMsg_System_ChangeSide,
//系统消息结束
//复位消息
VarMsg_Home,
VarMsg_Home_step,
VarMsg_Home_Finish,
VarMsg_All_Home,
VarMsg_All_Home_step,
VarMsg_All_Home_Finish,
//复位消息结束
VarMsg_Gem_TCP_Connect,
VarMsg_Gem_TCP_Select,
VarMsg_Gem_Select,
VarMsg_Gem_Test,
VarMsg_Gem_Listen,
VarMsg_Gem_Send,
VarMsg_Gem_LinkTest,
VarMsg_Calibration = 60100, //定位校正
VarMsg_Coat_ReplaceFluid = 60200, //更换涂覆液
//预切割并进行刀痕检测
VarMsg_Kerf_LaserCali_Process_ID = 60300,
//调试直接生成切割道
VarMsg_Debug_Align_Process_ID,
//定位完暂停
VarMsg_Locate_Process_PauseAfter_ID,
//调平完暂停
VarMsg_Align_Process_PauseAfter_ID,
//暂停后恢复
VarMsg_Resume_Process_Main_ID,
//功率复检
VarMsg_PowerCheck_ID,
VarMsg_PowerCheck_ALL_ID,
//平台厚度检测
VarMsg_PlatformCheck_ID,
//半切刀痕检测
VarMsg_Kerf_HalfCut_Process_ID,
//重做切割
VarMsg_RestartAutoCut,
VarMsg_RestartAutoCoat,
VarMsg_RestartAutoClean,
//取消自动过程中的操作
VarMSg_AbortAutoCut,
VarMsg_AbortAutoCoat,
VarMsg_AbortAutoClean,
VarMsg_AbortAutoTrans,
VarMsg_PowerCali_BeamRange_ID,
};
enum VarState_Logic {
//定位
VarState_Logic_Reserve = 70000,
VarState_Locate_Process_ID,
VarState_Locate_Single_ID,
//调平
VarState_Align_Process_ID,
/// 单点旋转调平
VarState_Align_Rotate_ID,
VarState_Align_R_MoveSearch_ID,
/// 单点旋转调平结束
/// 左点和中点调平
VarState_Align_Near_ID,
VarState_Align_Pt1_MoveSearch_ID,
VarState_Align_PtMid_MoveSearch_ID,
/// 左点和中点调平结束
/// 左点和右点调平
VarState_Align_Far_ID,
VarState_Align_Pt2_MoveSearch_ID,
/// 左点和中点调平结束
/// 基准点设定
VarState_Align_Base_ID,
VarState_Align_PtBase_MoveSearch_ID,
VarState_Align_Check_ID,
///
//////////////////////调平结束/////////////
/////////加工
VarState_Cut_Process_ID,
///////加工结束
///
/////////Kerf
VarState_Kerf_Process_ID,
VarState_Kerf_LaserCheck_Process_ID,
VarState_Kerf_HalfCut_Process_ID,
//功率矫正
VarState_PowerCali_ID,
//功率复检
VarState_PowerCheck_ID,
//定位校正
VarState_Calibration_ID,
//平台精度检测
VarState_PlatformCheck_ID,
//上下料
VarState_Transfer_Count_ID,
//上下料结束
//清洗涂敷
VarState_Coat_Step,
VarState_Clean_Step,
VarState_CleanTable_Step,
VarState_Spay_ID,
VarState_Bump_ID,
VarState_ReplaceFluid_ID,
//清洗涂敷结束
//基本状态
VarState_Idle_Coat,
VarState_Idle_Clean,
VarState_Idle_IO,
VarState_Idle_Main,
VarState_Idle_Transfer,
VarState_Idle_Schedular,
VarState_Semi_Coat,
VarState_Semi_Clean,
VarState_Semi_Main,
VarState_Semi_Transfer,
VarState_Semi_Schedular,
VarState_Wait_Coat,
VarState_Wait_Clean,
VarState_Wait_Main,
VarState_Wait_Transfer,
VarState_Wait_Schedular,
VarState_Work_CoatClean,
VarState_Work_Main,
VarState_Work_Transfer,
//基本状态结束
//复位
VarState_Home_Count,
//复位结束
//GEM
VarState_Idle_GEM,
VarState_Wait_GEM,
//GEM结束
VarState_LogicMax
};
#endif //LOGIC_LOCAL_DEF_H