#pragma once #include "Observer.h" #include "DlgPane.h" #include "MyBttom.h" class DlgCutDeviceCtrl : public CDlgPane,public CObserver { DECLARE_DYNAMIC(DlgCutDeviceCtrl) public: DlgCutDeviceCtrl(CWnd* pParent = NULL); // 标准构造函数 virtual ~DlgCutDeviceCtrl(); virtual UINT GetIDD(){return DlgCutDeviceCtrl::IDD;}; virtual void Update(); void SetPar(); void CheckStartState(); void StartWrokByBottom(); void SetWorkTime(CString s){m_WorkTime = s;}; void UpdateLaserParInfo(); // 对话框数据 enum { IDD = IDD_DEVICE_CTRL_DLG }; private: CMyBttom m_ReadDxfBtn; CMyBttom m_IniDeviceBtn; CMyBttom m_EndInspectionBtn; CMyBttom m_StartWorkBtn; CMyBttom m_SelMarkBtn; CMyBttom m_SaveParBtn; CMyBttom m_ReadMarkBtn; CMyBttom m_SaveMarkBtn; CMyBttom m_ProductBtn1; CMyBttom m_ProductBtn2; CMyBttom m_ProductBtn3; CMyBttom m_ProductBtn4; CMyBttom m_AdjustProductPosBtn; double m_LaserPower; int m_LaserFre; float m_LaserSpeed; int m_MarkAreaCutCount;//区域循环切割次数 int m_CutCount;//切割次数 //double m_SizeAdjust;//原件尺寸调整 int m_CurWorkTimes; int m_TotalWorkTimes; CString m_WorkTime;//加工时间 int m_CurProductIdx;//当前操作的 Dbxy m_OffsetAdjust;//偏移调整 Dbxy m_SizeAdjust;//偏移调整 double m_RotatoAdjust;//旋转调整mm int m_CurWorkStep; double m_MouldThickness;//模具的厚度mm protected: virtual void DoDataExchange(CDataExchange* pDX); // DDX/DDV 支持 afx_msg BOOL OnInitDialog(); afx_msg void OnTimer(UINT nIDEvent); DECLARE_MESSAGE_MAP() private: void UpdateInfo(); void AutoWork(); void SetProductBtnState(); void SetProductBtnStateExt(CMyBttom &btn,bool b); void OnBnClickedProduct(int idx); void OpenWorkFile(bool bDxf); public: afx_msg void OnBnClickedIniDeviceBtn(); afx_msg void OnBnClickedOpenDxfWorkFile(); afx_msg void OnBnClickedOpenMarkFile(); afx_msg void OnBnClickedStartWork(); afx_msg void OnBnClickedSelectedMark(); afx_msg void OnBnClickedSavePar(); afx_msg void OnBnClickedProduct1(); afx_msg void OnBnClickedProduct2(); afx_msg void OnBnClickedProduct3(); afx_msg void OnBnClickedProduct4(); afx_msg void OnBnClickedAdjustProductPos(); };