#pragma once
#include "module.h"

//激光
class CLaser :public CModule
{
public:
	CLaser(void);
	~CLaser(void);
	virtual MODULE GetModuleType(){return _LASER_PROP;};
	virtual CMFCPropertyGridProperty *CreatGridProperty();
        virtual void WriteWorkFileExt(vector<CLab> &LabVec);
	virtual void ReadWorkFile(CLabVecRang &LabVecRang);
	
	Dbxy GetCoord(){return m_LaserCoord;};
	void SetCoord(Dbxy pt){m_LaserCoord = pt;};
	int GetOpenDelay(){return m_OpenDelay;};
	void SetOpenDelay(int n){m_OpenDelay = n;};
	double GetBaseThickness(){return m_BaseThickness;};
	void SetBaseThickness(double n){m_BaseThickness = n;};
	double GetFocalAdjustVal();
	double GetWorkThickness(){return m_WorkThickness;};
	void SetWorkThickness(double n){m_WorkThickness = n;};
	void AddAdjustFocalCmd();
	void OnOpen();
	void OnClose();
	int                               m_CutSpeedIncrement = 0;//切割速度增量

private:
         Dbxy                            m_LaserCoord;//激光垂直点在平台的坐标(PLATFORM_COORD)
         int                               m_OpenDelay;//开关后延时 ms		 
         
         //激光焦距管理,Z 轴有电机的情况使用
         double                         m_BaseThickness;//用来调试焦距的基准产品厚度mm
         double                         m_WorkThickness;//当前加工的产品厚度mm
         double                         m_MaxThickness;//最大产品厚度mm
         double                         m_MinThickness;//最小产品厚度mm
};
extern CLaser *gLaser;